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Bond for silicon ingot fixture

Bond for silicon ingot fixture
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Brand Name

Q-Bond BS-8RA/HA

Product Group
  • Electronic & Inorganic Materials
Sector
  • Photovoltaic
  • Semiconductor
Use

The Q-Bond is used for fixing the Si-Ingot on a carrier, while slicing the Ingot in Wafers.

Description

Our Q-Bond is an adhesive which can be removed easily from the carrier after slicing the Ingot in Wafers. Thus breakage of a Wafer can be avoided during the removing process.

Country of origin

Japan

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