Bond for silicon ingot fixture

Q-Bond BS-8RA/HA

• Electronic & Inorganic Materials

• Photovoltaic
• Semiconductor

The Q-Bond is used for fixing the Si-Ingot on a carrier, while slicing the Ingot in Wafers.

Our Q-Bond is an adhesive which can be removed easily from the carrier after slicing the Ingot in Wafers. Thus breakage of a Wafer can be avoided during the removing process.

Japan